Semiconductor & Bonding Wire
Bonding wire is used in the 40 to 50 billion integrated circuits which are produced annually. California Fine Wire Co. is a custom manufacturer of fine drawn bonding wire. Materials used include gold and aluminum. Gold bonding wire is available in hard drawn, stress relieved, and annealed round and flat forms. Aluminum bonding wire is available as aluminum/1% silicon, aluminum/1% magnesium, and 99.999% purity aluminum bonding wire. Types of aluminum bonding wire include hard drawn, stress relieved, and annealed round or ribbon bonding wire. Aluminum/1% silicon bonding wire ranges in diameter, from 0.0007 in. to 0.003 in.
Please contact California Fine Wire for your fine and ultra-fine wire needs.